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www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300010-1-2 tsz22111 ? 14 ? 001 1/10 25.dec.2012.rev.001 datasheet cmos ldo regulator series for portable equipments versatile package full cmos ldo regulator buxxub3wg series general description buxxub3wg series is high-performance full cmos regulator with 360-ma output, which is mounted on versatile package ssop5 (2.9 mm 2.8 mm 1.25 mm). it has excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 50 a. it is most appropriate for various applications such as power supplies for logic ic, rf, and camera modules.rohms. features ? high accuracy detection ? low current consumption ? compatible with small cera mic capacitor (cin=co=1.0uf) ? with built-in output discharge circuit ? high ripple rejection ? on/off control of output voltage ? with built-in over current protection circuit and thermal shutdown circuit ? package ssop5 is sim ilar to sot-23-5 (jedec) ? low dropout voltage typical application circuit key specifications ? output voltage: 1.0v to 2.6v ? accuracy output voltage: 1.0% (25mv) ? low current consumption: 50 a ? operating temperature range: -40c to +85c applications battery-powered portable equipment, etc. package ssop5: 2.90mm x 2.80mm x 1.25mm fig.1 application circuit product structure:silicon monolithic integrated circuit this product is not designed protection against radioactive rays. downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300010-1-2 tsz22111 ? 15 ? 001 2/10 25.dec.2012.rev.001 buxxub3wg series datasheet connection diagram ssop5 pin descriptions ssop5 pin no. symbol function 1 vin power supply voltage 2 gnd grouding 3 stby on/off control of output voltage (high: on, low: off) 4 n.c. unconnected terminal 5 vout output voltage z ordering information (unit : mm) ssop5 2.9 0.2 0.13 4 + 6 4 1.6 2.8 0.2 1.1 0.05 0.05 0.05 + 0.2 0.1 + 0.05 0.03 0.42 + 0.05 0.04 0.95 5 4 12 3 1.25max. 0.2min. 0.1 lot. no top view vin gnd stby n.c. vout marking downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300010-1-2 tsz22111 ? 15 ? 001 3/10 25.dec.2012.rev.001 buxxub3wg series datasheet lineup absolute maximum ratings (ta=25c) parameter symbol limit unit power supply voltage vmax -0.3 +4.0 v power dissipation pd 540(*1) mw maximum junction temperature tjmax +125 operating temperature range topr -40 +85 storage temperature range ts t g - 5 5 +125 ( * 1)pd deleted at 5.4mw/ at temperatures above ta=25 , mounted on 70701.6 mm glass-epoxy pcb. recommended operating range (not to exceed pd) parameter symbol limit unit power supply voltage vin 1.7 3.6 v maximum output current imax 360 ma operating conditions (*2)make sure that the output capacitor value is not kept lower than this specified level across a v ariety of temperature, dc bias, changing as time progresses characteristi c. marking output voltage part number parameter symbol min. typ. max. unit condition input capacitor cin 0.47(*2) 1.0 - f output capacitor co 0.47(*2) 1.0 - f ceramic capacitor recommended downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300010-1-2 tsz22111 ? 15 ? 001 4/10 25.dec.2012.rev.001 buxxub3wg series datasheet electrical characteristics (ta=25, vin=vout+1.0v (*3), stby=vin, cin=1.0f, co=1.0f, unl ess otherwise noted.) this product is not designed for protection against radioactive rays. (*3) vin=2.5v for vout1.5v (*4) vin=2.5v to 3.6v for vout1.5v block diagrams limit parameter symbol min. typ. max. unit conditions overall device vout0.99 vout1.01 iout=10avout2.5v output voltage 1 vout1 vout-25mv vout vout+25mv v iout=10avout2.5v operating current iin - 50 90 a iout=0ma operating current (stby) istby - - 1.0 a stby=0v ripple rejection ratio rr 45 70 - db vrr=-20dbv,frr=1khz,iout=10ma, vin=3.6v - 470 700 mv 1.0vvout1.2v(iout=300ma) - 350 500 mv 1.2vvout1.5v(iout=300ma) - 280 380 mv 1.5vvout1.7v(iout=300ma) - 250 320 mv 1.7vvout2.1v(iout=300ma) - 220 260 mv 2.1vvout2.5v(iout=300ma) dropout voltage vsat - 200 220 mv 2.5vvout2.6v(iout=300ma) line regulation vdl - 2 20 mv vin=vout+1.0v to 3.6v(*4), iout=1 0a - 25 45 mv iout=0.01ma to 300ma load regulation vdlo - 35 55 mv iout=0.01ma to 360ma o v e r - c u r r e n t p r o t e c t i o n ( o c p ) limit current ilmax 370 550 - ma vo=vout*0.95 short current ishort 50 150 300 ma vo=0v standby block discharge resistor rdsc 20 50 80 vin=3.6v, stby=0v, vout=2.6v stby pin pull-down current istb 0.1 0.9 8.0 a stby=1.5v on vstbh 1.2 - 5.5 v stby control voltage off vstbl -0.3 - 0.3 v output voltage 2 vout2 1.7 1.8 1.9 v vin=2.375v to 2.625v vout=1.8v, iout=0.01ma to 300ma, ta=-4085 cin ??? 1.0 f (ceramic) co ??? 1.0 f (ceramic) cin vin gnd stby stby vout vout co vref ocp stby discharge tsd vin fig. 2 block diagrams downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300010-1-2 tsz22111 ? 15 ? 001 5/10 25.dec.2012.rev.001 buxxub3wg series datasheet z reference data bu18ub3wg (ta=25oc unless otherwise specified.) fig. 3 fig. 4 fig. 5 fig. 6 fig. 8 fig. 7 ] ] = = ] ] = = ] ] = ] ] = ] ] = ] ] = downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300010-1-2 tsz22111 ? 15 ? 001 6/10 25.dec.2012.rev.001 buxxub3wg series datasheet z reference data bu18ub3wg (ta=25oc unless otherwise specified.) ] ] = fig. 12 fig. 11 fig. 10 fig. 9 = == = == fig. 14 fig. 13 ] ] = ] ] = ] ] downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300010-1-2 tsz22111 ? 15 ? 001 7/10 25.dec.2012.rev.001 buxxub3wg series datasheet z reference data bu18ub3wg (ta=25oc unless otherwise specified.) = == = == fig. 16 fig. 15 fig. 17 = = = = = = = = = = = fig. 20 fig. 19 fig. 18 downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300010-1-2 tsz22111 ? 15 ? 001 8/10 25.dec.2012.rev.001 buxxub3wg series datasheet z reference data bu18ub3wg (ta=25oc unless otherwise specified.) fig. 21 = = = = = = fig. 22 downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300010-1-2 tsz22111 ? 15 ? 001 9/10 25.dec.2012.rev.001 buxxub3wg series datasheet z about power dissipation (pd) as for power dissipation, an approximate estimate of the hea t reduction characteristics and internal power consumption of ic are shown, so please use these for reference. sinc e power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wi ring rate, number of layers and through holes, etc.), it is recommended to measure pd on a set board. exceeding the po wer dissipation of ic may lead to deterioration of the original ic performance, such as causin g operation of the thermal shutdown circui t or reduction in current capability. therefore, be sure to prepare sufficient ma rgin within power dissipation for usage. calculation of the maximum internal power consumption of ic (pmax) pmax=(vin-vout)iout(max.) (vin: input voltage vout: output voltage iout(max): maximum output current) { measurement conditions standard rohm board top layer (top view) layout of board for measurement ic implementation position bottom layer (top view) measurement state with board im plemented (wind speed 0 m/s) board material glass epoxy resin (double-side board) board size 70 mm x 70 mm x 1.6 mm top layer metal (gnd) wiring rate: approx. 0% wiring rate bottom layer metal (gnd) wiring rate: approx. 50% through hole diameter 0.5mm x 6 holes power dissipation 0.54w thermal resistance ja=185.2c/w * please design the margin so that pmax becomes is than pd (pmax < pd) within the usage temperature range fig. 23 ssop5 power dissipation heat reduction characteristics (reference) 0 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125 ta [ ] pd [w] 0.54w 85 standard rohm board downloaded from: http:///
www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz02201-0rbr0a300010-1-2 tsz22111 ? 15 ? 001 10/10 25.dec.2012.rev.001 buxxub3wg series datasheet operation notes 1.) a b s o l u t e m a x i m u m r a t i n g s use of the ic in excess of absolute maximum ratings (such as the input voltage or operating temperat ure range) may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open mode) when such damage is suffered. if operational values are expected to exceed the maximum ratings for the device, consid er adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. 2.) g n d p o t e n t i a l the potential of the gnd pin must be the minimum potential in the system in all operating conditions . never connect a potential lower than gnd to any pin, even if only transiently. 3.) t h e r m a l d e s i g n use a thermal design that allows for a sufficient margin for that package power dissipation rating ( pd) under actual operating conditions. 4.) i n t e r - p i n s h o r t s a n d m o u n t i n g e r r o r s use caution when orienting and positioning the ic for mounting on printed circuit boards. improper m ounting or shorts between pins may result in damage to the ic. 5.) o p e r a t i o n i n s t r o n g e l e c t r o m a g n e t i c f i e l d s strong electromagnetic fields may cause the ic to malfunction. caution should be exercised in applic ations where strong electromagnetic fields may be present. 6.) c o m m o n i m p e d a n c e wiring traces should be as short and wide as possible to minimi ze common im pedance. bypass capacitors should be use to keep ripple to a minimum. 7.) v o l t a g e o f s t b y p i n to enable standby mode for all channels, set the stby pin to 0.3 v or less, and for normal ope ration, to 1.2 v or more. setting stby to a voltage between 0.3 and 1.2 v may cause malfunction and should be avoided. keep transitio n time between high and low (or vice versa) to a minimum. additionally, if stby is shorted to vin, the ic will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. if the ic is switched on again while this voltage is present, overshoot may occur on the output. therefore, in applications where these pins are shorted, the output should alw ays be completely discharg ed before turning the ic on. 8.) o v e r - c u r r e n t p r o t e c t i o n c i r c u i t ( o c p ) this ic features an integrated over-current and short-protection circuitry on the output to prevent destruction of the ic when the output is shorted. the ocp circuitry is designed only to protect the ic from irregular conditio ns (such as motor output shorts) and is not designed to be used as an active security device for the application. therefore, applications should not be designed under the assumption that this circuitry will engag e. 9.) t h e r m a l s h u t d o w n c i r c u i t ( t s d ) this ic also features a thermal shutdown circuit that is designed to turn the output off when the ju nction temperature of the ic exceeds about 150. this feature is intended to protect the ic only in the event of thermal overload and is not designed to guarantee operation or act as an active security device for the application. therefore, applicat ions should not be designe d under the assumption that this circuitry will engage. 10.) i n p u t / o u t p u t c a p a c i t o r capacitors must be connected between the input/output pins and gnd for stable operation, and should be physically mounted as close to the ic pins as possible (refer to figure 4). the input capacitor helps to counteract incre ases in power supply impedance, and increases stability in applications with long or winding power supply traces. the output capaci tance value is directly related to the overall stability and transient response of the regulator, and should be set to the largest possible value for the application to increase these characteristics. during design, keep in mind that in general, cera mic capacitors have a wide range of tolerances, temperature coefficients and dc bias characteristics, and that their capacitanc e values tend to decrease over time. confirm these details before choosing appropriate capacitors for your application.(please refer the technical note, regarding ceramic capacitor of recommendation) 11.) a b o u t t h e e q u i v a l e n t s e r i e s r e s i s t a n c e ( e s r ) o f a c e r a m i c c a p a c i t o r capacitors generally have esr (equivalent series resistance) and it operates stably in the esr-iout area shown on the right. since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different esr, please check the esr of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application. fig. 24 stable region (example) unstable region cout=1.0uf cin=1.0uf temp=25 ] ] stable unstable downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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